the NAND industry is facing bankruptcy of major suppliers. What’s happening?

Be that as it may, now the sales of memory chips are declining, and the market is still far from a stable position.

Problems are problems, and innovations continue to be introduced


One would think that due to the crisis, companies’ investment in new developments is reduced to zero. But this is not the case – many manufacturers do reduce the budgets of their research and development departments, but some even increase them. This applies to the same Phison company, which spends about 80% of the main budget on the modernization of production, the study of new technologies.

Engaged in new research, and successfully, and other companies. For example, Kioxia and WD have made progress in developing technologies that increase the speed of flash memory. This, for example, is an increase in the planes in each layer – separately working arrays of cells.

3d-nand-1

reportedthat the new memory with 210 layers involves reading two adjacent memory cells with one clock pulse. This innovation reduces the overall memory read time by 18%.

Tokyo Electron also announced new developments. She plans to talk about a method to rapidly etch over 10 micron (10 µm) vertical channels for 400-layer 3D NAND.

You may also be interested in these texts:

→ FlexGen in practice: will it be possible to run a heavy model without a powerful video card
→ ARM anthology: what are the prospects for processors in the server segment
→ Ways to organize infrastructure with databases: from simple to complex and efficient

Similar Posts

Leave a Reply

Your email address will not be published. Required fields are marked *